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IGBT Module 3300V/1500A Single, AlSiC , Low Vf

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DIM1500ESM33-MS000 Dynex Semiconductor
DIM1500ESM33-MS000 Dynex Semiconductor
DIM1500ESM33-MS000 Dynex Semiconductor
ID Code:179779
Manufacturer:Dynex Semiconductor
Price with VAT : 2 239,450908 €
Price without VAT : 1 850,785875 €
VAT:21 %
Availability:on request
Total stock:0 pcs
Marking manufacturer: DIM1500ESM33-MS000
Central warehouse Zdice: 0 pcs
Unit:: pcs
Overview of volume discounts
Quantity (pcs)Price without VATPrice with VAT
1 + 1 850,785875 €2 239,450908 €
3 + 1 804,490712 €2 183,433762 €
6 + 1 711,982037 €2 071,498265 €
12 + 1 573,178200 €1 903,545622 €
IGBT Module 3300V/1500A Single, AlSiC , Low Vf

Basic information:

Marking manufacturerDIM1500ESM33-MS000 
KategorieIGBT Full Silicon 
Number of circuits (in case) 3 ks
Case type:Modul 
Case [inch] :MODUL-E 
Type of material:Si-Silicon 
Material BaseALSiC 

Packaging and weight:

Weight:1900 [g]
Type of packaging:BOX 
Small package (Number of units):

Electro-physical parameters:

IFAV / IC (Tc/Ta=25°C)1500 [A]
IF(AV) (Tc/Ta=100÷119°C)1500 [A]
Uisol (@25°C/1min/50Hz)6000 [V]
UF (maximum forward voltage)1.9 [VDC] ?
Test conditions:
Ta=25°C, IF=In/Imax
UCE (sat) (@25°C)2.2 [V]
I2t (TC/TA=25°C)720 [1000*A2s]
Pmax with heatsink (TC=25°C)17900 [W]
tr (Turn-on / rise time)430 [ns]
tf/tq (Turn-off / fall time)660 [ns]

Thermal and mechanical parameters:

Dimensions (L*W*H) [mm]:190x140x38 
Tmin (minimum working temperature)-40 [°C]
Tmax (maximum working temperature)150 [°C]
Rth-c (thermal resistance) 0.007 [°C/W] ?

Rth-c - definitions for different components

Rth-c = Rthjc per whole case

Rth-c - foil surface inch2

L - Length 190 [mm]
W - Width 140 [mm]
H - Height 38 [mm]

Alternatives and replacements

Alternative products 1:FZ1500R33HE3 
Alternative products 2:CM1500HC-66R 
Alternative products 4:MBN1500E33E2 

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