Czech Republic (čeština) English Germany (Deutsch) Austria (Deutsch) Switzerland (Deutsch) Slovak Republic (slovenčina) Hungary (magyar) Romania (Română) France (français) Italy (italiano) Poland (polski) Estonia (eesti keel) Russia (pусский) Spain (español) Slovenia (slovenščina) Croatia (hrvatski) Bulgaria (български)
Your cart is currently empty


Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave

Click to enlarge
I+W300x200-100EG-11F Fujipoly
No longer in stock
ID Code:171893
Price: on request
VAT:21 %
Availability:on request
Total stock:0 pcs
Marking manufacturer: term300x200100EG-11F
Unit:: pcs
quantity discounts
QuantityPrice without VATPrice with VAT
Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.

Basic information:

Marking manufacturerterm300x200100EG-11F 
Case:Board 300x200 mm 
Type of component:!_fillers_! 

Electrical parameters:

Uisol (@25°C/1min/50Hz)500 [V]

Material, color, design:

Type of material:insulating 
Material: Housing!_sarcon egr_! 
ColorGY - grey 40% 

Thermal and mechanical parameters:

Tmin (minimum working temperature)-30 [°C]
Tmax (maximum working temperature)120 [°C]
Thermal conductivity1 W/m*K
Rth Thermal Impedance1.36 K-in2/W


W - Width 200 [mm]
L - Length 300 [mm]
T - thickness[mm]
Dimensions of outlets0.00 [mm]

Packaging and weight:

Weight:200 [g]
Packaging (Number of units):18 

Alternatives and replacements

Alternative products 1:I+W300x200-100GR-C &FP 

Your question I+W300x200-100EG-11F

Your name, surname, company:*
Your email:*
Your phone number:*
Your question:*
Please rewrite code:* antispam
     More information

!_poslete odkaz svemu znamenu_!

Your name
Your email
e-mail your friend
Please rewrite code from the image antispam
Copyright © by


In the provision of services help us to cookies. By using our services you consent to our use of cookies.   More information