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I+W300x200-100EG-11F

Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave

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I+W300x200-100EG-11F Fujipoly
No longer in stock
ID Code:171893
Manufacturer:Fujipoly
Price: on request
VAT:21 %
Availability:on request
Total stock:0 pcs
Marking manufacturer: term300x200100EG-11F
Unit:: pcs
quantity discounts
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Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.

Basic information:

Marking manufacturerterm300x200100EG-11F 
Case:Board 300x200 mm 
Type of component:!_fillers_! 
Configuration:!_plain_! 
Specification:Soft 
RoHSYes 
REACHNo 
NOVINKA

Electrical parameters:

Uisol (@25°C/1min/50Hz)500 [V]

Material, color, design:

Type of material:insulating 
Material: Housing!_sarcon egr_! 
ColorGY - grey 40% 

Thermal and mechanical parameters:

Tmin (minimum working temperature)-30 [°C]
Tmax (maximum working temperature)120 [°C]
Thermal conductivity1 W/m*K
Rth Thermal Impedance1.36 K-in2/W

Dimensions:

W - Width 200 [mm]
L - Length 300 [mm]
T - thickness[mm]
Dimensions of outlets0.00 [mm]

Packaging and weight:

Unit:pcs 
Weight:200 [g]
Packaging (Number of units):18 

Alternatives and replacements

Alternative products 1:I+W300x200-100GR-C &FP 

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