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I+W300x200-100EG-11F

Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave

No longer in stock
ID Code:171893
Manufacturer:Fujipoly
Price: on request
VAT:21 %
Availability:on request
Total stock:0 pcs
Marking manufacturer: 100EG-11F
Unit:: pcs
Overview of volume discounts
Quantity (pcs)Price without VATPrice with VAT
Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.

Basic information:

Marking manufacturer100EG-11F 
Type of component:Fillers 
Configuration:Plain 
Specification:Soft 
Case [inch] :I+W300x200 
Type of material:Insulating 
Material: HousingSarcon EGR 
ColorGY - grey 40% 
RoHSYes 
REACHNo 
NOVINKA

Packaging and weight:

Unit:pcs 
Weight:200 [g]
Type of packaging:BOX 
Small package (Number of units):18 

Electro-physical parameters:

Uisol (@25°C/1min/50Hz)500 [V]

Thermal and mechanical parameters:

Tmin (minimum working temperature)-30 [°C]
Tmax (maximum working temperature)120 [°C]
Thermal conductivity1 W/m*K
Rth Thermal Impedance1.36 K-in2/W
L - Length 300 [mm]
W - Width 200 [mm]
T - thickness[mm]

Alternatives and replacements

Alternative products 1:I+W300x200-100GR-C &FP 

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