Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.
Basic information:
Marking manufacturer | 100EG-11F |
Type of component: | Fillers |
Configuration: | Plain |
Specification: | Soft |
Case [inch] : | I+W300x200 |
Type of material: | Insulating |
Material: Housing | Sarcon EGR |
Color | GY - grey 40% |
RoHS | Yes |
REACH | No |
NOVINKA | N |
Packaging and weight:
Unit: | pcs |
Weight: | 200 [g] |
Type of packaging: | BOX |
Small package (Number of units): | 18 |
Electro-physical parameters:
Uisol (@25°C/1min/50Hz) | 500 [V] |
Thermal and mechanical parameters:
Tmin (minimum working temperature) | -30 [°C] |
Tmax (maximum working temperature) | 120 [°C] |
Thermal conductivity | 1 W/m*K |
Rth Thermal Impedance | 1.36 K-in2/W |
L - Length | 300 [mm] |
W - Width | 200 [mm] |
T - thickness | 1 [mm] |
Alternatives and replacements
Alternative products 1: | I+W300x200-100GR-C &FP |