SiC Diode 3 Phase Bridge Power Module 700V/ 50A SP1
ID Code: | 188058 |
Manufacturer: | Microchip Technology |
Price with VAT : | 146,601026 € |
Price without VAT : | 121,157873 € |
VAT: | 21 % |
Availability: | on request |
Total stock: | 0 pcs |
Marking manufacturer: | MSCDC50X701AG |
Factory Lead Time: | 42wk-49wk |
Unit:: | pcs |
Overview of volume discounts | Quantity (pcs) | Price without VAT | Price with VAT | |
1 + | 121,157873 € | 146,601026 € | ||
5 + | 116,111681 € | 140,495134 € | ||
10 + | 111,063026 € | 134,386261 € | ||
25 + | 106,014781 € | 128,277885 € |
Marking manufacturer | MSCDC50X701AG |
Factory Lead Time | 42wk-49wk [wk] |
Type of component: | Bridge 3f Uncontrolled |
Kategorie | Bridge Schottky SiC |
Configuration: | Bridge 3f |
Number of circuits (in case) | 2 ks |
Case type: | Modul |
Case [inch] : | SP1F |
Type of material: | SiC |
RoHS | Yes |
REACH | No |
NOVINKA | A |
RoHS1 | Ano |
Unit: | pcs |
Weight: | 96 [g] |
Type of packaging: | TUBE |
Small package (Number of units): | 1 |
IFAV / IC (Tc/Ta=25°C) | 50 [A] |
Idc max (Tc/Ta=80÷89°C) | 50 [A] |
IF(AV) (Tc/Ta=120÷129°C) | 35 [A] |
IF(AV) (Tc/Ta=130÷139°C) | 30 [A] |
Uisol (@25°C/1min/50Hz) | 4000 [V] |
UF (maximum forward voltage) | 1.8 [VDC] ? Test conditions: Ta=25°C, IF=In/Imax |
IR (reverse current) | 200 [µA] |
Dimensions (L*W*H) [mm]: | 52x43x12 |
Tmin (minimum working temperature) | -40 [°C] |
Tmax (maximum working temperature) | 175 [°C] |
Rth-c (thermal resistance) | 0.86 [°C/W] ? Rth-c - definitions for different components Rth-c = Rthjc per whole case Rth-c - foil surface inch2 |
RM - Pitch pins | 3.8 [mm] |
RM1 - Spacing of rows | 38 [mm] |
L - Length | 51.6 [mm] |
W - Width | 42.5 [mm] |
H - Height | 12 [mm] |
Dimensions of outlets | 1,4 [mm] |
Lv - Length of outlets | 5.8 [mm] |
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I+case 25,4x 38,2_F05-AL2 Thermally Conductive Pad for insulated Packages SOT-227, ISOTOP and in size 25,4x38,1 mm ID: 181709 Mfr.no.: F05-AL2_25,4x38,2mm_SOT227Uni
| Total stock: 7512 Manufacturer: SEMIC EU |