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S1C-3 Assembly

Clamped Capsules Devices between Heat Sinks (Custom Assemblies)

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S1C-3 Assembly Dynex Semiconductor
No longer in stock
ID Code:174616
Manufacturer:Dynex Semiconductor
Price: on request
VAT:21 %
Availability:on request
Total stock:0 pcs
Central warehouse: 0 pcs
Unit:: pcs
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Clamped Capsules Devices between Heat Sinks (Custom Assemblies)

Basic information:

Case type:PUK 
Material: HousingNo Info 
RoHSYes 
REACHNo 
NOVINKA
RoHS1Ano 

Packaging and weight:

Unit:pcs 
Weight:0.099 [g]
Small package (Number of units):

Electro-physical parameters:

UF (maximum forward voltage)99.99 [VDC] ?
Test conditions:
Ta=25°C, IF=In/Imax

Thermal and mechanical parameters:

Tmin (minimum working temperature)[°C]
Tmax (maximum working temperature)[°C]

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